The world's first 3D chip was born: 60 billion transistors were integrated, breaking the 7Nm process limit

The world's first 3D Packaging chip was born ！UK based AI Chip company Graphcore Released a IPU product Bow, TSMC is used 7 Nano 3D Packaging technology .

According to introducing , This processor will improve the speed of computer training neural networks 40%, At the same time, the energy consumption ratio has increased 16%.

Can have such a big improvement , It is also said to benefit from TSMC's 3D WoW Silicon wafer stacking technology , Thus, the overall improvement of performance and energy consumption ratio is realized .

As just mentioned , And Graphcore Compared with the previous generation ,Bow IPU Can train key neural networks , The speed is about 40%, meanwhile , Efficiency has also improved 16%.

Meanwhile , With the technical support of TSMC ,Bow IPU The number of transistors in a single package has also reached an unprecedented level , Have more than 600 100 million transistors .

The official said ,Bow IPU The change is that this chip uses 3D encapsulation , The size of transistors has increased , Computing power and throughput have been improved ,Bow Can execute... Per second 350 One trillion flop Mixing accuracy of AI operation , It's from the previous generation 1.4 times , Throughput from 47.5TB To improve the 65TB.

Knowles Call it the highest performance in the world today AI processor .

Bow IPU The birth of proves that the improvement of chip performance does not necessarily need to improve the process , You can also upgrade the packaging technology , Transfer to advanced packaging .

Graphcore CTO and co founders Simon Knowles Express ,「 We are entering an era of advanced packaging . In this day and age , Multiple silicon chips will be packaged together , To compensate for the slowing Moore's law (Moore’s Law) The performance benefits of continuous progress on the road .」